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Pac Tech-Packaging Technologies GmbH

Обновления и архивы

www.pactech.de;
SEMICON RUSSIA 2016 (M)
Pac Tech-Packaging Technologies GmbH
Германия
D-14641, Nauen, Am Schlangenhorst 15-17
poosch@pactech.de
www.pactech.de
PacTech manufactures equipment
for the microelectronic & advanced
packaging industry and offers wafer
level bumping & packaging contract
manufacturing out of Germany, USA
and Malaysia. Products: solder jetting
equipment, wafer-level solder ball
transfer systems, wafer-level solder
rework equipment, laser assisted flipchip
bonders and wet chemical lines for
electroless NiAu & NiPdAu plating.

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