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Обновления и архивы
SEMICON SOLARCON RUSSIA 2013 (r)
Site d`Archamps - Immeuble Alliance
Bailment C, Archamps, F-74160
Amkor`s broad product portfolio includes leadframe, ball grid array, chip scale and wafer level packaging. Specialty packaging for MEMS and sensors are also supported, along with wafer bumping services. Amkor maintains, and continues to build upon, an industry leading position in flip chip and advanced packaging. Newer package platforms have included Package-on-Package (PoP) with Through Mold Via (TMV) technology, flip chip molded BGA (FCMBGA) packages, and a makeover of the standard PBGA. Newer technologies such as fine pitch copper pillar micro-bumps and the development of the manufacturing infrastructure supporting stacked CSPs to through silicon via (TSV) architectures have received widespread attention.
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